Tailor Made Materials
Firstly the materials functionality required for the targeted applications will be identified.These multiple functionality requirements will then be used to create the design specification of the new materials.
The design process will be driven by molecular modelling of structure-property relationship, experimentation and processing.
Novel Manufacture
Once the multi-functional materials have
been produced they will be applied to the target applications in an integrated Chip on Board (COB) manufacturing line.This will allow the integration and packaging of the lighting device directly onto the substrate, with consequent advantage in terms of reduced processing, reduced part size
and cost of the device.
The reactive deposition technology will use M3D to accurately deposit a layer of the newly designed material which is then cured. The process is repeated layer for layer allowing the manufacture of high aspect ratio 3D deposits directly onto and encapsulating the chip-LED in situ on the circuit board (diagram).
The M3D manufacturing technique was chosen as the deposition technique as it allows fine, accurate (down to 10 micron) deposition of viscous materials (approaching 2500cP) envisaged for use in this project. As a non-contact, direct write process novel large area and 3D displays and lighting arrays can be created.
The materials will be based on polymeric resins in which nano-particles, of different nature, are embedded or built in, in order to create the desired multi-functionality. The specific properties are controlled and tailored by changing the nature, size, composition, and concentration of the nano-particles, in accordance to the design specification.