Project Aim
The project will design, develop and apply tailor made muIti-functional optoelectronic materials
for displays and lighting applications. These new materials will enhance the performance and efficiency of current solid-state optoelectronic devices such as displays, imaging sensors, photonic circuits, and light-emitting diodes (LEDs). The unique multi-functionality will also allow radical new product designs in the target applications. The project will also develop and optimise an integrated reactive packaging route based on M3DTM direct writing for these novel materials.
Benefits
The project represents a breakthrough in multifunctional electronic packaging because it delivers a complete integration between material design, preparation, processing and assembling of the final device. It is expected that the designed materials will increase the efficiency of LED sources compared to currently available materials. Also the new materials coupled with the novel packaging technology will allow cost effective manufacturing and the ability to create new product designs such as 3D shaped displays or lighting arrays.